Passivation of copper by silicide formation in dilute silane
- 1 May 1992
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 71 (9) , 4623-4625
- https://doi.org/10.1063/1.350765
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Oxidation protection for a variety of transition metals and copper via surface silicides formed with silane containing atmospheresJournal of Materials Research, 1991
- An XPS study of the reaction of silane with oxidized copper, silver, and gold surfacesSurface Science, 1985
- Reactivity of intermetallic thin films formed by the surface mediated decomposition of main group organometallic compoundsJournal of Vacuum Science & Technology A, 1984
- Resistivities of Thin Film Transition Metal SilicidesJournal of the Electrochemical Society, 1982