X-ray lithography for microfabrication
- 1 September 1980
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science and Technology
- Vol. 17 (5) , 1164-1168
- https://doi.org/10.1116/1.570633
Abstract
Recent advances in x-ray lithography combined with the application of reactive sputter etching techniques for the pattern transfer are reviewed in this paper. The x-ray system, the mask structure, and the x-ray resist are described. Resist processing and pattern transfer are discussed as applied to the fabrication of NMOS devices with 0.7 μm effective channel lengths.Keywords
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