Preparation, structure, and fracture modes of Pb-Sn and Pb-In terminated flip chips attached to gold-capped microsockets
- 4 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 360-367
- https://doi.org/10.1109/ectc.1990.122215
Abstract
No abstract availableKeywords
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