An alternative physical explanation of the Hall–Petch relation
- 1 February 2004
- journal article
- Published by Elsevier in Acta Materialia
- Vol. 52 (3) , 657-665
- https://doi.org/10.1016/j.actamat.2003.10.002
Abstract
No abstract availableKeywords
This publication has 12 references indexed in Scilit:
- Size-induced enhanced mechanical properties of nanocomposite copper/niobium wires: nanoindentation studyActa Materialia, 2002
- Nano-scaled multi-layered bulk materials manufactured by repeated pressing and rolling in the Cu–Fe systemMaterials Science and Engineering: A, 2001
- Mechanical response and modeling of fully compacted nanocrystalline iron and copperInternational Journal of Plasticity, 2000
- Grain boundary strengthening of copper-base copper–manganese and copper–gallium solid solutionsPublished by Elsevier ,1999
- Plastic deformation of nanocrystalline Cu and Cu–0.2 wt.% BMaterials Science and Engineering: A, 1999
- Elastic and tensile behavior of nanocrystalline copper and palladiumPublished by Elsevier ,1998
- On the flow stress/grain size correlation in copper and alpha-brassJournal of Materials Science Letters, 1996
- The study of grain size dependence of yield stress of copper for a wide grain size rangeActa Metallurgica et Materialia, 1994
- Model for the prediction of the mechanical behaviour of nanocrystalline materialsMaterials Science and Engineering: A, 1993
- Importance ofky(Hall-Petch slope) in determining strength of steelsMetals Technology, 1984