Multi-Layer Thick-Film Technology: A Convenient Way to Design Compact and Efficient Microwave Components
- 1 October 1992
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1176-1180
- https://doi.org/10.1109/euma.1992.335863
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Characterization of Strip Line Crossing by Transverse Resonance AnalysisIEEE Transactions on Microwave Theory and Techniques, 1987
- Parameters of Microstrip Transmission Lines and of Coupled Pairs of Microstrip LinesIEEE Transactions on Microwave Theory and Techniques, 1968