The Use of Dielectric Analysis to Study the Cure of a Filled Epoxy Resin
- 1 December 1981
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electrical Insulation
- Vol. EI-16 (6) , 496-501
- https://doi.org/10.1109/tei.1981.298380
Abstract
This paper presents the results of a study in which dielectric analysis was used to optimize catalyst concentration and minimize mold cycle time for an epoxy casting compound. The casting compound used was based on an anhydride cured hydantoin epoxy resin. Increasing the catalyst concentration to reduce mold time results in a reduced pot life. Using dielectric analysis, gel times and cure times were determined for several catalyst concentrations. Arrhenius plots for the gel times were obtained and minimum cure times for an optimum formulation were determined. The method described here is of general application ation and may be used to optimize formulations and cure cycles for many polymer processes.Keywords
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