Resist Materials Utilizing Oxygen Plasma Resistance of Iodine Compounds
- 1 May 1985
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 132 (5) , 1168-1171
- https://doi.org/10.1149/1.2114052
Abstract
Relative rates were measured for polymer film loss in an oxygen plasma environment. Both polymers doped with iodine compounds and iodinated polymers show high resistance to the oxygen plasma. Our ESCA studies on iodinated polystyrenes indicate that the oxygen plasma converts the iodo‐substituent to iodine oxides. Through taking advantage of the oxygen plasma resistance of iodine compounds, we have been able to come up with a two‐layer photolithography system for microfabrication. In the context of this two‐layer process, evaluations were made of a positive photoresist formulated from OFPR‐800 (Tokyo Ohka Kogyo Company) and 2,4,6‐triiodophenol, as well as a negative deep‐UV resist composed of iodinated poly(vinyl phenol) and 3,3′‐diazidodiphenyl sulfone.Keywords
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