Thermal challenges in MEMS applications: phase change phenomena and thermal bonding processes
- 1 March 2003
- journal article
- Published by Elsevier in Microelectronics Journal
- Vol. 34 (3) , 179-185
- https://doi.org/10.1016/s0026-2692(02)00186-6
Abstract
No abstract availableKeywords
This publication has 21 references indexed in Scilit:
- A thermal-bubble-actuated micronozzle-diffuser pumpJournal of Microelectromechanical Systems, 2002
- Vacuum packaging technology using localized aluminum/silicon-to-glass bondingJournal of Microelectromechanical Systems, 2002
- Active microfluidic mixer and gas bubble filter driven by thermal bubble micropumpSensors and Actuators A: Physical, 2002
- Transient Thermal Bubble Formation on Polysilicon Micro-ResistersJournal of Heat Transfer, 2001
- A hermetic glass-silicon package formed using localized aluminum/silicon-glass bondingJournal of Microelectromechanical Systems, 2001
- MEMS post-packaging by localized heating and bondingIEEE Transactions on Advanced Packaging, 2000
- Formation of Silicon-Gold Eutectic Bond Using Localized Heating MethodJapanese Journal of Applied Physics, 1998
- MICROSCALE THERMAL BUBBLE FORMATION: THERMOPHYSICAL PHENOMENA AND APPLICATIONSMicroscale Thermophysical Engineering, 1998
- Microelectromechanical filters for signal processingJournal of Microelectromechanical Systems, 1998
- Thermal bubble powered microactuatorsMicrosystem Technologies, 1994