The Effect of Film Adhesive on the Delamination Strength of Tapered Composites

Publisher Website
Google Scholar
Abstract
Film adhesive is used to suppress delamination in tapered glass/epoxy laminates. Two different stacking sequences with thin section layups of [0 4/ ±452] s and [± 452/0 4] s containing three equidistant internal double-ply drops of ± 45° plies are in vestigated. Tapered specimens are manufactured and tested under quasi-static uniaxial ten sion. They are also modeled with and without layers of film adhesive. Thin interply resin layers are included in the model for direct assessment of the interlaminar stress state as well as for better modeling of the tapered region. The experimental study indicates an in crease in the delamination onset load for the [±452/04] s specimens with film adhesive which corresponds to a decrease in the predicted stress state. However, the experimental study does not show any significant change in the delamination onset load in the [04/ ±452] s specimens even though the analysis indicates a decrease in the stress state. This indicates that for this stacking sequence, the taper is not the dominant contributor to the onset of delamination.

This publication has 4 references indexed in Scilit: