Effects of deposition temperature and substrate bias on orientation and hardness of thick sputter deposited beryllium foils
- 31 March 1973
- journal article
- Published by Elsevier in Journal of the Less Common Metals
- Vol. 30 (3) , 351-359
- https://doi.org/10.1016/0022-5088(73)90146-x
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Thermal microstresses in beryllium and other HCP materialsMetallurgical Transactions, 1971
- Room-Temperature Recrystallization in Thick Bias-Sputtered Copper DepositsJournal of Applied Physics, 1971
- The properties of beryllium surfaces and films a reviewJournal of the Less Common Metals, 1969
- Orientation of Vacuum-Deposited Be Thin FilmsJournal of Applied Physics, 1964