A tin based TAB assembly process
- 9 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Overview of Tape Automated Bonding TechnologyCircuit World, 1990
- A Review of Corrosion Failure Mechanisms during Accelerated Tests: Electrolytic Metal MigrationJournal of the Electrochemical Society, 1987