Failure in Tungsten-Filled Via Structures
- 1 January 1995
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Interpretation of Resistance Changes during Interconnect Reliability TestingMRS Proceedings, 1994
- Stress evolution due to electromigration in confined metal linesJournal of Applied Physics, 1993
- Evidence of The Electromigration Short-Length Effect in Aluminum-Based Metallurgy With Tungsten Diffusion BarriersMRS Proceedings, 1993
- Electromigration-Induced Failures in VLSI InterconnectsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1982
- Stress generation by electromigrationApplied Physics Letters, 1976