Thermal and dielectric properties and curing kinetics of nanomaterials formed from poss-epoxy and meta-phenylenediamine
- 1 September 2004
- Vol. 45 (20) , 6897-6908
- https://doi.org/10.1016/j.polymer.2004.07.070
Abstract
No abstract availableKeywords
This publication has 19 references indexed in Scilit:
- Organic/Inorganic Hybrid Epoxy Nanocomposites from AminophenylsilsesquioxanesMacromolecules, 2003
- Polyimide-Side-Chain Tethered Polyhedral Oligomeric Silsesquioxane Nanocomposites for Low-Dielectric Film ApplicationsChemistry of Materials, 2003
- Synthesis and Dielectric Properties of Polyimide-Chain-End Tethered Polyhedral Oligomeric Silsesquioxane NanocompositesChemistry of Materials, 2003
- Epoxy Networks Containing Large Mass Fractions of a Monofunctional Polyhedral Oligomeric Silsesquioxane (POSS)Macromolecules, 2003
- Viscoelastic and mechanical properties of vinyl ester (VE)/multifunctional polyhedral oligomeric silsesquioxane (POSS) nanocomposites and multifunctional POSS–styrene copolymersPolymer, 2002
- Comparative DSC kinetics of the reaction of DGEBA with aromatic diamines. II. Isothermal kinetic study of the reaction of DGEBA with m-phenylene diaminePolymer, 2002
- The Synthesis of Hybrid Polymers Using Atom Transfer Radical Polymerization: Homopolymers and Block Copolymers from Polyhedral Oligomeric Silsesquioxane MonomersMacromolecules, 1999
- Experimental modeling of the cure kinetics of an epoxy-hexaanhydro-4-methylphthalicanhydride (MHHPA) systemPolymer, 1999
- Mechanical Relaxation and Microstructure of Poly(norbornyl-POSS) CopolymersMacromolecules, 1999
- Linear Hybrid Polymer Building Blocks: Methacrylate-Functionalized Polyhedral Oligomeric Silsesquioxane Monomers and PolymersMacromolecules, 1995