Etching processes for High Aspect Ratio Micro Systems Technology (HARMST)

• 22 November 1996
• journal article
• Published by Springer Nature in Microsystem Technologies
• Vol. 3  (1) , 20-27
• https://doi.org/10.1007/s005420050049

Abstract

Keywords

• STRUCTURES
• RIE
• DRY ETCHING
• WAFER
• HARMST
• ETCHED SI
• ELECTRO