Packaging of MEMS devices

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Abstract
This paper examines issues in the packaging of silicon-micromachined devices. Standard microelectonics packaging seeks to physically isolate the integrated circuits from harmful elements in the environment, to provide mechanical strength for the die, to facilitate thermal dissipation, and to sustain electrical communication with outside circuits. However, due to the many novel applications of MEMS devices, new sets of packaging requirements need to be met and further research on packaging technology to meet non-traditional requirements are needed.

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