theta /sub jc/ characterization of chip packages-justification, limitations, and future
- 1 January 1989
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 12 (4) , 724-731
- https://doi.org/10.1109/33.49039
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Package thermal resistance model: dependency on equipment designIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988
- Thermal characterization of plastic and ceramic surface-mount componentsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988