X-ray exposure system using finely position adjusting apparatus

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Abstract
An apparatus for finely adjusting the three‐dimensional position of a workpiece and the application of this apparatus to high power x‐ray lithography are presented. The relative positioning apparatus has been designed, using electrodynamic transducers for the x, y, and z directions and an electrostrictive transducer for rotary direction (ϑ). Motions in each direction are supported by a resilient plate. The relative position of mask and wafer has been detected by applying a mechanical vibration to the wafer, with an accuracy of less than ±0.1 μm. The fine positioning mechanisms have displayed excellent performance with high accuracies. As a first step to constructing a working apparatus, a prototype exposure system was built using pattern replication in an atmospheric environment, comprised of a positioning system and a high‐power x‐ray source with a rotary Al target operated at more than 20‐kW electron‐beam input power. The characteristic x ray has been irradiated on a wafer through a contractile vacuum pipe. Using an exposure test, the system functions have been confirmed as a fine pattern replicating system.

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