Abstract
Electroplating of aluminium on copper and steel substrates was conducted at room temperature. The bath consisted basically of and an alkali metal bromide such as dissolved in a suitable mixture of aromatic hydrocarbons. The bath was operated under conditions resembling industrial operation. Oxygen and humidity were removed by bubbling nitrogen through the bath. The effect of bath composition on the quality of the plated product is discussed in detail. Transference numbers were measured. The aluminium is shown to be present in the form of a negative ion , the transference number of which is larger than that of the solvated positive ion. The reactions taking place during deposition and dissolution of aluminium in this system are discussed in detail.

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