Abstract
A wide variety of thin-film materials (TiO2, SiO2, Al2O3, HfO2, Ta2O5, ITO, Y2O3, CeO2, Si3N4, ZrO2, Au, Ag, and MgF2) were deposited using conventional electron beam and thermal evaporation techniques with a concomitant bombardment of energetic oxygen ions from a gridless end-Hall ion source. The oxygen-ion-assisted deposition was performed with an ion-beam current of approximately one Ampere over a range of 40 to 120 eV, providing a uniform ion current density (.3 to .5 mA/cm2) impinging on a large substrate area (5024 cm2). Compared to film deposited using standard gridded ion sources this process produces optically equivalent materials with a broad ion beam which is well suited for volume manufacturing.

This publication has 0 references indexed in Scilit: