Injection molded solder technology for Pb-free wafer bumping
- 28 September 2004
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Pb-free solder alloys for flip chip applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Chip-to-Package InterconnectionsPublished by Springer Nature ,1989
- Controlled Collapse Reflow Chip JoiningIBM Journal of Research and Development, 1969