On the failure mechanism of anisotropically conductive adhesive joints on copper metallisation
- 1 January 1996
- journal article
- Published by Elsevier in International Journal of Adhesion and Adhesives
- Vol. 16 (4) , 285-287
- https://doi.org/10.1016/s0143-7496(96)00016-4
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Development of conductive adhesive joining for surface-mounting electronics manufacturingIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1995
- Reliability assessment of isotropically conductive adhesive joints in surface mount applicationsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1995