New Strategies for Joining Ceramics for High-Temperature Applications

• 1 September 1995
• journal article
• Published by Trans Tech Publications, Ltd. in Key Engineering Materials
• Vol. 111-112, 157-190
• https://doi.org/10.4028/www.scientific.net/kem.111-112.157

Abstract

Keywords

• ALUMINUM (AL)
• BRAZING
• DIFFUSION BONDING (DB)
• FRACTURE
• INTERFACIAL REACTION
• JOINING
• PHASE EQUILIBRIUM
• SILICON CARBIDE (SIC)
• TRANSIENT LIQUID