Encapsulated silver for integrated circuit metallization
- 3 June 2003
- journal article
- review article
- Published by Elsevier in Materials Science and Engineering: R: Reports
- Vol. 40 (6) , 207-250
- https://doi.org/10.1016/s0927-796x(03)00025-1
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Texture and microstructural evolution of thin silver films in Ag/Ti bilayersJournal of Applied Physics, 1998