Reliability Assessment and Screening by Reliability IndicatorMethods

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Abstract
Built-in flaws in electronic components have been recognized as a serious cause of failure. They are difficult to screen away by conventional methods because the times-to-failures for component working in systems are often rather long and because accelerated burn-in may screen by the wrong failure mechanisms. As an alternative, the concept and possible use of reliability indicator methods are discussed and some recently developed methods described.

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