Columnar microstructure and stress measurements in amorphous W0.75Si0.25 thin films

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Abstract
Columnar microstructure has been observed in direct‐current sputter deposited amorphous metal thin films of W0.75Si0.25. Transmission electron microscopy was used to examine the films, both in cross section and plan view. Individual columns are 50–150 Å in diameter and the morphology is typical of a zone 1 structure. In contrast, films of the same composition deposited by magnetron sputtering did not exhibit a columnar microstructure. The dc sputtered films were also found to be in tensile stress when deposited on silicon substrates. Measured stresses ranged from 6.5×108 Pa for 4000 Å films with a linear increase to 8×108 Pa for 33 000 Å films. For films thinner than 4000 Å the stress in the films dropped off rapidly. The linear increase in stress seen was attributed to mutual attractive forces between adjacent columns.

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