Air bridge and via hole technology for GaAs based microwave devices
- 31 October 1988
- journal article
- Published by Elsevier in Microelectronics Journal
- Vol. 19 (5) , 23-27
- https://doi.org/10.1016/s0026-2692(88)80135-6
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Improved Via Hole Etching for Source Grounding of Microwave MESFETJournal of the Electrochemical Society, 1986
- Fabrication of Via Holes in 200 μm Thick GaAs WafersJournal of the Electrochemical Society, 1983