Ion beam milling of pyroelectric ceramics for advanced thermal detector arrays

Publisher Website
Google Scholar
Abstract
Imaging thermal detector arrays are currently being developed with large pixel counts at fine pitch. One major cause of image degradation in such arrays is by lateral thermal spread within the pyroelectric ceramic wafer on which the sensing array is defined. This paper discusses the use of ion beam milling to create thermal breaks between adjacent elements, significantly improving the modulation transfer function of the array. Masking techniques, etch rates, and pattern transfer characteristics are described. The effects of the ion milling conditions upon the chemical composition and electric resistivity of pyroelectric ceramic surfaces are described and discussed in the context of thermal detector array applications. The use of broad-beam ion milling to thin pyroelectric ceramic wafers with minimal surface damage is also briefly described.
Keywords

This publication has 0 references indexed in Scilit: