Advanced automation technology for photonics packaging delivers improved device performance and lower cost
- 22 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
Automation is playing an increasingly key role in photonics device manufacturing now that the markets are demanding larger volumes. High-precision machinery is now becoming commercially available which can offer turn-key production solutions to photonics assembly and test applications. Automated alignment and device testing, along with more robust attachment techniques (like laser welding), are improving device-to-device consistency, enhancing package environmental resistance, lowering costs and enabling manufacturers to maximize the performance of their devices and their systems.Keywords
This publication has 1 reference indexed in Scilit:
- Low-cost fabrication of optical subassembliesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002