Simulation of the Influence of Manufacturing Quality on Reliability of Vias
- 1 June 1995
- journal article
- Published by ASME International in Journal of Electronic Packaging
- Vol. 117 (2) , 141-146
- https://doi.org/10.1115/1.2792081
Abstract
Techniques based on physics-of-failure principles are fairly well established for mechanical design of electronic packages. This paper provides an example where such techniques can also be exploited to develop guidelines for assessment of manufacturing quality and its impact on reliability. As a case study, this study examines the influence of plating waviness in vias and Plated Through Holes (PTH), on reliability during solder reflow cycles and during subsequent operational thermal cycling. The stress analysis is performed with elastic-plastic finite element models which are seeded with various levels of plating waviness defects. Sensitivity analysis is done with factorial parametric simulation studies based on Design of Experiment (DOE) methods. Buckling and fatigue failure models are used to establish inspection criteria for acceptable thresholds of plating waviness.Keywords
This publication has 5 references indexed in Scilit:
- Cyclic Plastic Strain Energy and Fatigue of MetalsPublished by ASTM International ,2009
- A Fractional-Factorial Numerical Technique for Stress Analysis of Glass-To-Metal Lead SealsJournal of Electronic Packaging, 1994
- Fatigue Criteria Under Combined Stresses or StrainsJournal of Engineering Materials and Technology, 1981
- Fatigue: A complex subject—Some simple approximationsExperimental Mechanics, 1965
- Use of Half-Normal Plots in Interpreting Factorial Two-Level ExperimentsTechnometrics, 1959