Exceptional performance from the development, qualification and implementation of a silicone adhesive for bonding heatsinks to semiconductor packages
- 1 March 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 18 (1) , 94-100
- https://doi.org/10.1109/95.370741
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Evaluation of thermally conductive adhesives for bonding heat sinks to electronic packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Strains in Aluminum-Adhesive-Ceramic TrilayersJournal of Electronic Packaging, 1990