The formation of Cu3Sn intermetallic on the reaction of cu with 95Pb-5Sn solder

This publication has 8 references indexed in Scilit:

• Microelectronic Packaging
  Scientific American, 1983
• Cu-Pb-Sn Ternary System: Low Cu Additions to Pb-Sn- Binary System
  MRS Proceedings, 1982
• The Growth of Intermetallic Compounds on Common Basis Materials Coated with Tin and Tin-Lead Alloys
  Transactions of the IMF, 1976
• Interdiffusion in CuSn solid solutions. confirmation of anomalously large kirkendall effect
  Scripta Metallurgica, 1975
• Reaction-Diffusion in the Cu–Sn System
  Transactions of the Japan Institute of Metals, 1975
• Interdiffusion and reaction in bimetallic Cu-Sn thin films
  Acta Metallurgica, 1973
• On the Growth of Alloy Layer between Solid Copper and Liquid Tin
  Transactions of the Japan Institute of Metals, 1972
• Studies of the SLT Chip Terminal Metallurgy
  IBM Journal of Research and Development, 1969