Deep trench plasma etching of single crystal silicon using SF6/O2 gas mixtures
- 1 May 1992
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
- Vol. 10 (3) , 1105-1110
- https://doi.org/10.1116/1.586085
Abstract
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