Abstract
The film thickness of the electron resist polymethylmethacrylate (PMMA) deposited on has been measured using ellipsometry. Film thicknesses as large as 2 μm may be measured simply and nondestructively in this manner, and these types of measurements are valuable for process control in electron‐beam writing on semiconductors. The ellipsometric measurements were checked using interference microscopy and showed excellent agreement. A calibration curve of deposited‐film thickness as a function of substrate spin rate is presented as an example of the utility of thickness measurements.

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