Mechanical design considerations for area array solder joints
- 1 May 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 16 (3) , 272-283
- https://doi.org/10.1109/33.232053
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Chip-to-Package InterconnectionsPublished by Springer Nature ,1989
- Comments on Aleck’s Stress Distribution in Clamped PlatesJournal of Applied Mechanics, 1981
- Geometric Optimization of Controlled Collapse InterconnectionsIBM Journal of Research and Development, 1969
- SLT Device Metallurgy and its Monolithic ExtensionIBM Journal of Research and Development, 1969