Development and application of the stress sensing test chip for IC plastic packages.
- 1 January 1987
- journal article
- Published by Japan Society of Mechanical Engineers in TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
- Vol. 53 (493) , 1826-1832
- https://doi.org/10.1299/kikaia.53.1826
Abstract
No abstract availableThis publication has 0 references indexed in Scilit: