Dielectric behavior at microwave frequencies of an epoxy resin during crosslinking
- 5 December 1993
- journal article
- Published by Wiley in Journal of Applied Polymer Science
- Vol. 50 (9) , 1583-1590
- https://doi.org/10.1002/app.1993.070500912
Abstract
No abstract availableKeywords
This publication has 15 references indexed in Scilit:
- Comparison of reaction mechanisms of epoxy resins undergoing thermal and microwave cure from in situ measurements of microwave dielectric properties and infrared spectroscopyMacromolecules, 1992
- Relaxations in thermosets: 5. Dielectric studies of the effects of substitution of amines on curing kinetics and ageing of an epoxide thermosetPolymer, 1991
- Relaxations in thermosets. X. Analysis of dipolar relaxations in DGEBA‐based thermosets during isothermal cureJournal of Polymer Science Part B: Polymer Physics, 1991
- Viscosity modeling during epoxy resin curePolymer Engineering & Science, 1989
- Microwave Processing and Diagnosis of Chemically Reacting Materials in a Single-Mode Cavity ApplicatorIEEE Transactions on Microwave Theory and Techniques, 1987
- A new microwave dielectric method for studying photoinitiated chain radical polymerization processesJournal of Polymer Science Part B: Polymer Physics, 1987
- Dielectric studies of the cure of epoxy matrix systemsJournal of Applied Polymer Science, 1986
- Kinetic analysis of photoinitiated polymerization by microwave dielectrometryJournal of Polymer Science Part C: Polymer Letters, 1985
- Evaluation of dielectric behavior by time domain spectroscopy. 3. Precision difference methodsThe Journal of Physical Chemistry, 1980
- Characterization of the time‐temperature‐viscosity behavior of curing B‐staged epoxy resinPolymer Engineering & Science, 1975