Deposition by etching-enhanced reactive sputtering: A new high-rate deposition method for SiO2 and TiO2

Publisher Website
Google Scholar
Abstract
This paper introduces a new hybrid thin film deposition technique that combines reactive sputtering and plasma etching. Using this technique, increases in deposition rates of SiO2 by 30 times and TiO2 by 10 times have been obtained on conventional dc magnetron sputtering equipment. The technique is named deposition by etching-enhanced reactive sputtering, or DEERS. The background of DEERS’s conception and experimental results of Cl-based DEERS of SiO2 and TiO2 as well as other potential DEERS systems are described.

This publication has 0 references indexed in Scilit: