Materials Limitations in the Higher Electronic Packaging Levels
- 1 January 1987
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
Microminiaturization is desirable for reasons of lower cost, lower volume and weight, higher performance, and higher reliability. Microminiaturization is best achieved by downscaling the feature sizes on the chip itself, and this indeed continues to be the major driving force in the electronics revolution. It is normally cheaper, weighs less, is faster, and is more reliable to put as much of a system's interconnection effort on the chip itself (i.e., packaging level 0). Costs increase steeply for interconnections on the higher levels.Keywords
This publication has 2 references indexed in Scilit:
- The Thin-Film Module as a High-Performance Semiconductor PackageIBM Journal of Research and Development, 1982
- Effect of Scaling of Interconnections on the Time Delay of VLSI CircuitsIEEE Journal of Solid-State Circuits, 1982