Embedded transmission line (ETL) MMIC for low-cost, high-density wireless communication applications

Abstract
A new embedded transmission line (ETL) MMIC approach which allows flexibility in mixing different transmission line types (i.e., coplanar and striplines) for maximum MMIC (Monolithic Microwave Integrated Circuits) design flexibility and permits the elimination of back-side processing for low production cost is described. This ETL MMIC approach is an enabling technology allowing for low-cost, batch fabrication, and high-density integration of microwave and RF components (including silicon mixed signal products) for emerging wireless communication applications.

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