Application of Non‐destructive Testing to Inspection of Soldered Joints

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Abstract
There is an increasing requirement for inspection of electronic components, assemblies and interconnections, and to meet this demand there are new developments in inspection techniques. None of the techniques is universally applicable, but many are capable of consistent and reliable results. This paper outlines the major techniques which are available and summarises their capabilities. The limitations on types of component and boards which may be examined are listed, and the difficulties of detecting some flaws with some techniques are highlighted and the reasons considered.

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