High Packing Density, High Speed CMOS (Hi-CMOS) Device Technology

• 1 January 1979
• journal article
• Published by IOP Publishing in Japanese Journal of Applied Physics
• Vol. 18  (S1)
• https://doi.org/10.7567/jjaps.18s1.73

Abstract

Keywords

• DEVICE TECHNOLOGY
• PACKING DENSITY
• HIGH PACKING
• HIGH SPEED CMOS