Strength Loss Mechanisms for Adhesive Bonds to Electroplated Zinc and Cold Rolled Steel Substrates Subjected to Moist Environments

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Abstract
Mechanisms of strength toss which affect the durability of epoxy adhesive bonds in moist environments were investigated for electroplated zinc and cold rolled steel substrates. Activation energies for adhesion loss, formation of corrosion product on the substrate surface, and moisture diffusion in the adhesive were determined experimentally. For cold rolled steel substrates, the activation energy for adhesion loss was identical, within experimental error, to the measured activation energy for moisture diffusion in the adhesive. Both of these values were substantially less (=40%) than the activation energy for formation of corrosion product. This confirms the previous results of Gledhill and Kinloch (J. Adhesion 6, 315 (1974)), who attributed strength loss to thermodynamic instability of the adhesive/substrate interface due to the presence of moisture. In contrast, for electroplated zinc substrates, activation energies for adhesion loss and corrosion product formation were essentially equal, and were both significantly higher than that for moisture diffusion. Consequently, it was concluded that corrosion of the electroplated zinc layer was responsible for bond strength loss. Formation of corrosion product in the bond was not, therefore, a post-failure phenomenon as was the case for cold rolled steel.