Cathode polarization and the growth habit of electrodeposited copper
- 1 October 1961
- journal article
- Published by Elsevier in Electrochimica Acta
- Vol. 5 (1-2) , 79-86
- https://doi.org/10.1016/0013-4686(61)87006-0
Abstract
No abstract availableThis publication has 23 references indexed in Scilit:
- Some observations on copper electrodepositsElectrochimica Acta, 1961
- The structure of electrodeposited copper—I: An experimental study of the growth of copper during electrodepositionElectrochimica Acta, 1960
- The structure of electrodeposited copper—IIIElectrochimica Acta, 1960
- Kinetik der elektrolytischen abscheidung und auflösung von metallen in wässriger lösungElectrochimica Acta, 1960
- Discussion of “Role of Thiourea in the Electrodeposition of Copper” [B. Ke, J. J. Hoekstra, B. C. Sison, Jr., and D. Trivich (pp. 382–388, Vol 106)]Journal of the Electrochemical Society, 1959
- The mechanism of electrolytic metal depositionProceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences, 1958
- Twinned epitaxy of copper on copperJournal of Research of the National Bureau of Standards, 1958
- CATHODE SURFACE CHANGES IN THE PRESENCE OF GELATIN DURING ELECTRODEPOSITION OF COPPERCanadian Journal of Research, 1943
- USE OF THE HARING CELL FOR MEASURING ADDITION AGENT CONCENTRATION IN ELECTROLYTIC BATHSCanadian Journal of Research, 1943
- EFFECT OF SURFACE ON CATHODE POLARIZATION DURING THE ELECTRODEPOSITION OF COPPERCanadian Journal of Research, 1943