Proposed ultrahigh frequency microstrip utilising buried silicide groundplane

Abstract
Recently it has become possible to produce buried singlecrystal silicide layers in silicon on which epitaxial silicon may be grown. We show that if such a layer is used as a groundplane in a microstrip configuration, ultra-high-speed signals (e.g. 100 GHz) can be propagated with far less dispersion than on standard microstrip, by virtue of the close proximity of the groundplane to the centre conductor.