Thermal Stress Failure of Porcelain Bonded to a Palladium-Silver Alloy
- 1 March 1985
- journal article
- research article
- Published by SAGE Publications in Journal of Dental Research
- Vol. 64 (3) , 476-480
- https://doi.org/10.1177/00220345850640031801
Abstract
Cracking or rupturing, due to thermal stress, of porcelain bonded to a palladium-silver alloy indicated that porcelain-metal thermal compatibility was dependent on: the difference in thermal expansion coefficients of the porcelain and metal; the geometry and dimensions of the samples; and the porcelain-metal thickness ratio. A spherical configuration was more sensitive to thermal expansion coefficient differences than was a disc configuration. A higher incidence of cracking resulted from an increase in both specimen size and porcelain-metal thickness ratio.Keywords
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