Fuzzy regression approach to modelling transfer moulding for microchip encapsulation
- 1 September 2003
- journal article
- Published by Elsevier in Journal of Materials Processing Technology
- Vol. 140 (1-3) , 147-151
- https://doi.org/10.1016/s0924-0136(03)00702-7
Abstract
No abstract availableKeywords
Funding Information
- Hong Kong Polytechnic University (H-ZH35)
This publication has 6 references indexed in Scilit:
- Reactive flow simulation in transfer molding of IC packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A new approach to fuzzy regression models with application to business cycle analysisFuzzy Sets and Systems, 2002
- Modelling and optimization of grinding processesJournal of Intelligent Manufacturing, 1998
- Fuzzy versus statistical linear regressionEuropean Journal of Operational Research, 1996
- Optimization of Process Parameters of Injection Molding with Neural Network Application in a Process Simulation EnvironmentCIRP Annals, 1994
- On the Simulation of Microelectronic Encapsulation with Epoxy Molding CompoundJournal of Reinforced Plastics and Composites, 1993