Thermal stability of various ball-limited-metal systems under solder bumps
- 6 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Lead-Indium for Controlled-Collapse Chip JoiningIEEE Transactions on Parts, Hybrids, and Packaging, 1977
- Diffusion and Solubility of Copper in Extrinsic and Intrinsic Germanium, Silicon, and Gallium ArsenideJournal of Applied Physics, 1964