Thermally induced shifts in an optical fiber soldered into a ferrule

27 November 2002

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

Vol. 2, 388-389
https://doi.org/10.1109/leos.1998.739759

Abstract

The thermally induced fiber shifts under a temperature cycling test of an optical fiber soldered into a ferrule packaging was measured experimentally. Up to a 0.18 /spl mu/m of the fiber shift was found in temperature cycling from -40 to +85/spl deg/C. This fiber displacement may arise from both the relief of the residual stresses and the intermetallic compound growth within the solder during the temperature cycling test. A finite-element method (FEM) analysis was also performed on the calculation of the up-bound fiber shift. Results showed that up to a 0.27 /spl mu/m of the fiber shift was predicted. This indicates that the FEM is an effective method for predicting the up-bound fiber shifts in temperature cycling test for laser module reliability study.

Keywords

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