I n s i t u strain measurements during the formation of platinum silicide films
- 1 September 1991
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
- Vol. 9 (5) , 2536-2541
- https://doi.org/10.1116/1.585688
Abstract
Using an in situ double optical beam technique, the evolution of the strain for the Pt–Si system was followed before, during, and after reaction. During initial heating and prior to reaction only a compressive thermal stress is observed whereupon reaction to form Pt2Si yields a compressive intrinsic stress. The mechanism for stress buildup and relaxation is elucidated and shown to be related to the relative motion of Pt and Si atoms during the respective processes.This publication has 0 references indexed in Scilit: