The properties of tin-bismuth alloy solders
- 1 July 1993
- journal article
- Published by Springer Nature in JOM
- Vol. 45 (7) , 28-32
- https://doi.org/10.1007/bf03222377
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Solder Joint Reliability—Can Solder Creep?Soldering & Surface Mount Technology, 1990